Liobate to Showcase Advanced TFLN Photonic Solutions at CIOE 2026

Visit Liobate at Hall 12, Booth 12D53, September 9–11, 2026, Shenzhen World Exhibition & Convention Center

Liobate will exhibit at the 27th China International Optoelectronic Exposition (CIOE 2026), taking place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center. We invite optical-communication professionals, system developers, technology partners, and industry peers to visit Liobate at Hall 12, Booth 12D53 and explore our latest thin-film lithium niobate (TFLN) photonic integrated circuit and electro-optic device technologies.

CIOE is a major platform for the global optoelectronics industry, connecting technologies and suppliers across chips, materials, devices, modules, equipment, and system solutions. The CIOE 2026 edition is expected to cover 260,000 square meters, host more than 4,000 exhibitors, welcome over 150,000 professional visitors, and feature more than 90 conferences and related events.

At CIOE 2026, Liobate will present high-speed TFLN products developed to support the growing performance requirements of optical communications, data interconnect, advanced testing, sensing, and emerging photonic systems.

Liobate’s TFLN Solutions on Display at CIOE 2026

At Booth 12D53, visitors can explore Liobate’s TFLN chips and devices for high-speed optical communications, data interconnect, and photonic integration.

Featured products at the booth will include:

•1.6T DR8/DR4 and 800G DR8/DR4 chips for next-generation data-center and high-speed optical-interconnect architectures.

•128 GBaud PDMIQ chips for advanced coherent and polarization-multiplexed optical transmission systems.

•Ultra-broadband TFLN chips with bandwidths above 130 GHz, developed for demanding high-speed and microwave-photonic applications.

•40G and 70G IQ modulators, designed for high-speed coherent communication and related electro-optic applications.

•40G phase modulators for phase-modulated communications, interferometric sensing, spectral shaping, LiDAR, and quantum-related systems.

•40G, 67G, and 110G intensity modulators, supporting digital communication, optical computing, analog photonics, optical sensing, and laser-based systems.

•Ultra-low-V_π modulators, enabling lower-voltage electro-optic operation for selected applications and device architectures.

•Ultra-narrow-linewidth linear frequency-swept lasers for high-resolution measurement, optical sensing, and frequency-modulated continuous-wave LiDAR.

•Optical frequency-comb devices for precision measurement, spectroscopy, quantum communications, and other advanced photonic applications.

Rather than offering a single-device approach, Liobate is building a TFLN product portfolio that spans core chip technologies, packaged modulators, integrated optical solutions, and customized photonic development.

Picture shown: Liobate TFLN products

Who Should Visit Liobate at CIOE 2026?

If you are exploring high-performance electro-optic devices, next-generation optical-interconnect components, or customized TFLN PIC solutions for an upcoming project, we welcome you to visit Liobate at Hall 12, Booth 12D53 for further discussions.

Our team looks forward to meeting professionals from across the photonics ecosystem, including:

•AI data center and cloud infrastructure teams exploring 800G, 1.6T, and higher-capacity optical interconnect solutions.

•Optical communication and coherent-transmission developers working with high-baud-rate, polarization-multiplexed, and advanced modulation formats.

•Optical transceiver, module, and optical-engine manufacturers seeking high-speed devices, lower-power operation, compact integration, and robust packaging performance.

•Microwave-photonics and test-and-measurement specialists requiring ultra-broadband electro-optic modulation, low drive voltage, and stable device operation.

•LiDAR, optical-sensing, and precision-measurement innovators interested in phase control, narrow-linewidth swept lasers, optical frequency combs, and integrated photonic solutions.

•PIC developers, research institutions, and equipment manufacturers looking for TFLN chips, multi-channel modulators, hybrid integration, or tailored packaging support.

Bring your application goals, target specifications, and integration challenges to our booth. Liobate’s technical and business teams will be available to discuss suitable device options, custom development pathways, and how our TFLN platform can support your project.

About Liobate

1. Who Is Liobate?

Liobate is a high-tech photonics company focused on thin-film lithium niobate (TFLN) modulator photonic integrated circuits (PICs) and related optical communication and interconnect sub-assemblies. Founded in July 2020, Liobate develops TFLN-based products for data centers, communication networks, test instruments, sensing systems, and automotive-related applications.

2. What Can Liobate Do?

Liobate provides TFLN modulator chips, packaged electro-optic devices, and customized photonic solutions for high-speed optical communications and advanced photonic systems. Our portfolio includes intensity, phase, and coherent modulators, along with high-speed optical-engine and microwave-photonic solutions.

Operating under an IDM model, Liobate maintains in-house capabilities across PIC design, wafer fabrication, device packaging, process engineering, and manufacturing development. Our platform supports TFLN modulator chips and devices for optical communication applications from 100G to 3.2T, as well as multi-channel modulators, integrated photonic circuits, and hybrid solutions involving lasers or detectors.

3. Why Partner with Liobate?

Liobate combines chip design, fabrication, and packaging within one integrated development framework. This enables close control of the performance factors that matter in practical deployment, including optical loss, RF bandwidth, driving voltage, fiber-to-chip coupling, compact form factor, and device reliability.

Built on proprietary expertise in low-loss optical waveguides, broadband RF circuit design, and TFLN packaging, Liobate works with customers from early technical evaluation through customized development and delivery. From standard high-speed modulators to customized TFLN PIC development, Liobate can discuss options that align with your technical requirements and product plans.

Meet Liobate at CIOE 2026

As high-speed networks, AI computing infrastructure, precision instrumentation, and intelligent sensing applications continue to advance, the need for high-bandwidth, low-power, and compact photonic solutions keeps growing. Liobate is committed to helping customers explore how TFLN technology can support their next-generation products and system roadmaps.

For in-person discussions, visit Liobate at Hall 12, Booth 12D53 during CIOE 2026 to discuss high-speed modulator chips, optical-interconnect devices, frequency-swept laser solutions, optical frequency combs, and customized TFLN PIC development!