Shaping the 3.2T Era: Liobate Unveils Next-Gen TFLN Innovations at OFC 2026
About OFC 2026
The Optical Fiber Communication Conference and Exhibition (OFC) is the world’s leading event for optical communications and networking professionals. OFC 2026 will be held at the Los Angeles Convention Center from March 15–19, 2026, with the exhibition taking place from March 17–19.
Bringing together over 16,700 attendees and 700 global exhibitors, the conference gathers industry leaders, including Coherent, NVIDIA, and Tesat-Spacecom, to showcase innovations in optical networks, components, systems, and testing technologies. For more information, you can visit: https://www.ofcconference.org/home/.
At OFC 2026, Liobate will present its advanced thin-film lithium niobate (TFLN) platform, demonstrating the transition from photonic research breakthroughs to scalable industrial applications.
Why visit Liobate at OFC 2026?
Engage directly with our technical team led by world-renowned experts like Prof. Cai Xinlun. Gain authoritative insights into overcoming the “bandwidth wall” in 1.6T/3.2T system architectures and address complex integration challenges like EO modulator stability.
Beyond standard components, we offer deep-dive discussions on customized TFLN solutions. Explore how our ultra-low voltage, high-linearity modulators can be optimized for your specific architectures—from 1.6T/3.2T IMDD chips for AI factory networking to 128GBaud Coherent solutions for long-haul telecom. We also offer ultra-compact modulators designed to meet the rigorous size and power constraints of LiDAR and autopilot systems.
Liobate is not just a laboratory innovator; we are a high-volume manufacturing partner. Visit us to learn about our full-stack IDM capabilities, including our dedicated 6-inch and 8-inch wafer fabrication lines and proprietary packaging technologies (Box, COB, and customized integration). We are open to discussing long-term strategic collaborations for the stable supply of TFLN PICs and modules to support your global product roadmap!
FAQs
Several of our key TFLN modulator products have already reached the mass production stage, supported by our complete process platform in Nanjing.
Liobate currently supports both 6-inch and 8-inch TFLN wafer production, ensuring high yield and consistency across large-scale manufacturing runs.
We offer a variety of packaging solutions to suit different integration needs, including Box, COB (Chip on Board), and fully customized packaging options for specific high-performance applications.
Liobate’s TFLN platform sets industry benchmarks with ultra-high performance:
- Modulation Bandwidth: Exceeding 145 GHz.
- Driving Voltage (Vpi): Less than 1.5V.
- Insertion Loss (IL): Less than 5dB (including coupling loss).
- Stability: Superior thermal stability and a proprietary solution that eliminates DC drift, ensuring reliable signal integrity at extreme data rates.
Yes. We are actively seeking strategic partnerships for joint development and offer custom PIC designs tailored to specific high-speed optical application needs.
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